Two days of lectures by representatives of the industry, as well as clinical and academic speakers, presentations by the Mimics Innovation Awards winners, ground-breaking case studies, the latest innovations in additive medical technologies, etc. will make you get to know all new features and clinical applications of the software. You will meet your colleagues and experts in the field in a sensational setting. This year we will host one Main Session on April 22, and a dedicated FEA session on April 23. The best part is... you don’t pay anything!

Leuven, Belgium, January 6, 2010. Materialise NV, the world leader in software development for medical image processing, announces the release of Mimics^13.1. This software, part of the Mimics Innovation Suite, has become the standard in 3D image processing and editing based on CT or MRI data. Users of this latest version will experience, among others, the optimized and extended measurement tools.    The release of Mimics 13.1 fulfills the promise Materialise made to deliver two high-quality software releases per year. With this release, the company takes another leap forward in 3D image processing. The most significant improvement is the new capability for re-slicing your medical dataset.  This function allows the user to reorient the imported dataset in any arbitrary direction, which makes visualizing, segmenting and measure off-axis much quicker and more accurate. In addition, Mimics 13.1 includes several new measurements and updates in some existing measurements.  Materialise also made improvements to the user-friendliness and flexibility of 3D LiveWire, our unique segmentation tool introduced in Mimics 13. 3D LiveWire can now save contours and move points set during segmentation. “Everybody knows that ‘to measure is to know’”, says Erik Boelen, Mimics Product Specialist. “That’s why the new release focuses on making measuring easier. The real-time re-slicing tool will contribute a great deal to that. Visualizing and measuring off-axis structures will now be a piece of cake, since you’ll be able to reorient your dataset along a user-defined plane. We’re confident that measurements will be more intuitive and precise, consequently providing the user with more knowledge.” The new features include:

New Simulation Advancements in Electronics Thermal Management Reduce Engineering Time and Accelerate Product Development

SOUTHPOINTE, PA - July 1, 2009 - ANSYS, Inc. (NASDAQ: ANSS), a global innovator of simulation software and technologies designed to optimize product development processes, today announced the latest release of ANSYS® Icepak® software, which provides robust and powerful fluid dynamics technology for electronics thermal management. The 12.0 release introduces new solutions for printed circuit board (PCB) and package thermal analysis, new and enhanced technology for meshing complex geometry, and new physical modeling capabilities. These advances enable engineers who design electronic components for products such as cell phones, computers and graphics cards to improve design performance, reduce the need for physical prototypes and shorten time to market in the highly competitive electronics industry.

Driving Productivity Throughout the Product Lifecycle

Latest Release Focused on Teamcenter Inside Desktop Tools and Processes, New PLM Applications, New Industry Solutions, SOA Platform Extensibility, and Support for IBM

PLANO, Texas, June 23, 2009 - Siemens PLM Software, a business unit of the Siemens Industry Automation Division and a leading global provider of product lifecycle management (PLM) software and services, today announced the latest release of Teamcenter® software, the world’s most widely used PLM system. The Teamcenter 8 release focuses on individual, application and IT productivity, with a wide variety of enhancements as well as new support for IBM software including Information Management (DB2®), WebSphere® Application Server (WAS), Tivoli® Access Manger, Tivoli Storage Manager, and Rational® ClearCase®. With Teamcenter as a single source of product and process knowledge, individuals and teams can be more productive around-the-clock and from anywhere in the world.

New version introduces 3D LiveWire to easily segment very complex or low-quality scan data.